Signal Integrity
Boost the performance of your products with our SI experts. We design the optimal routing topologies for high speed & memory interconnects (PCIe, JESD, Ethernet, DDR), as well as complex multilayer stackups that balance performance with cost.
Our SI experience saves the need for multiple prototyping cycles via building accurate simulation models and reusable simulation workspaces.
Power Integrity
We design and verify power delivery networks (PDNs) for high-speed ASICs & FPGAs to ensure reliability and stability. We develop and implement test plans and procedures for power integrity testing.
You can consider us the subject matter experts on power integrity for your team.
RF & Microwave Design
We advise on susbtrate material selection, and we then design transmission lines and analyse losses and isolation. Complex via transitions and connectors footprints are impedance-matched to achieve the best possible return loss at the frequency of operation.
We carry out post-layout simulations to predict performance before releasing the gerbers for manufacturing.
ASIC Packaging
Packaging plays a significant role in meeting the desired balance between performance, size, cost, electrical & mechanical performance, and assembly requirements. We help choose the optimal package technology for your application.
We carry out all the required SI, PI, and thermal analyses for your package design to ensure performance is met and save design iterations.
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